Infineon Technologies AG is to build a new factory for power semiconductors. The market and technology leader in this segment will thereby create the foundation for long-term, profitable growth. A fully automated chip factory for manufacturing 300-millimeter thin wafers will be constructed at the Villach location in Austria alongside the existing production facility. Austria’s Chancellor Sebastian Kurz, Dr. Reinhard Ploss, Chief Executive Officer of Infineon, and Dr. Sabine Herlitschka, Chief Executive Officer of Infineon Austria, presented the project in Vienna. Investments totaling around €1.6 billion are planned over six years. Some 400 new jobs, especially highly qualified ones, will be created by the new, highly efficient factory. Construction is scheduled to start in the first half of 2019 and production is expected to commence at the start of 2021. The additional sales potential of the new factory, given full capacity utilization, is put at around €1.8 billion a year.
“Global demand for power semiconductors is soaring. As the market and technology leader, Infineon is particularly sought-after by customers and is even growing more strongly than the market,” said Dr. Reinhard Ploss, Chief Executive Officer of Infineon. “Growth is underpinned by global megatrends such as climate change, demographic change and increasing digitization. Electric vehicles, connected and battery-powered devices, data centers or power generation from renewable sources require efficient and reliable power semiconductors. We recognized that trend early on and so are rapidly expanding production capacities for 300-millimeter technology at our Dresden location. The new facility at Villach will help us cater for the growing demand that our customers anticipate, and continue on our path to success in the coming decade. Backed by the unique expertise we have built at our locations in Europe, we as a global company can strengthen our position on the world market long term.”