Order Now Introduction: Below is a summary of the US Power Electronics Technology and Manufacturing Roadmap, developed by the US Power Electronics Industry Collaborative (PEIC) and submitted as the final report to NIST for PEIC’s … →
PEIC is excited that member Kyma Technologies, Inc.was awarded $3M under the SBIR category and $1M as sub to a non-SBIR awardee to further develop its proprietary hydride vapor phase epitaxy (HVPE) growth technology for fabricating crystalline GaN substrates. Michigan State University’s researchers were also awarded to work on diamond diode and transistor devices.
PEIC and it’s members recently submitted letters in support of Sandia, Oak Ridge Northrop Grumman, and Novati in forming WBG Advanced Manufacturing Innovation Institute.
As active market players in power electronics at the global stage, PEIC’s members clearly understand the benefits and challenges facing widespread adoption of WBG. PEIC’s members believe that, to achieve the DOE/AMO’s “Next Generation Power Electronics Institute” stated goal as described in FOA683 of “transition products & technologies from R&D to the marketplace,” there are two key elements required…
When: March 28, 2013 Where: NextEnergy, Detroit Compound wide bandgap semiconductor materials (WBG) such as silicon carbide (SiC) and gallium nitride (GaN) are important enabling platforms for the advanced clean energy economy. PEIC is partnering with … →